Plasmon Excitations of Multi-layer Graphene on a Conducting Substrate

Plasmon Excitations of Multi-layer Graphene on a Conducting Substrate.

We predict the existence of low-frequency nonlocal plasmons at the vacuum-surface interface of a superlattice of N graphene layers interacting with conducting substrate. We derive a dispersion function that incorporates the polarization function of both the graphene monolayers and the semi-infinite electron liquid at whose surface the electrons scatter specularly. We find a surface plasmon-pola...

single-step synthesis of multi-component spirobarbiturates using ionic liquids and synthesis of substituted pyridine filled with catalysts supported on solid substrate

in this thesis, a better reaction conditions for the synthesis of spirobarbiturates catalyzed by task-specific ionic liquid (2-hydroxy-n-(2-hydroxyethyl)-n,n-dimethylethanaminium formate), calcium hypochlorite ca(ocl)2 or n-bromosuccinimide (nbs) in the presence of water at room temperature by ultrasonic technique is provided. the design and synthesis of spirocycles is a challenging task becaus...

Deposition of Few Layer Graphene on Plastic Substrate for Using Conductive Layer at Metal Electroplating

Plasmon excitations in carbon nanotubes

Electron-energy-loss spectroscopy (EELS) in a high-resolution transmission electron microscope can be used to study the excitation of plasmons in nanometre-size particles with high spatial resolution. For isotropic particles of various shapes, models which allow the attribution of the experimental peaks to a certain excitation mechanism and to understand sizeor geometry-dependent variations are...

Effects of multi-layer graphene capping on Cu interconnects.

The benefits of multi-layer graphene (MLG) capping on Cu interconnects have been experimentally demonstrated. The resistance of MLG capped Cu wires improved by 2-7% compared to Cu wires. The breakdown current density increased by 18%, suggesting that the MLG can act as an excellent capping material for Cu interconnects, improving the reliability characteristics. With a proper process optimizati...